Posted:
June 06, 2026
Location:
Boise, ID, United States

Job Description

**Our vision is to transform how the world uses information to enrich life for** **_all_** **.**

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As a Product Yield Enhancement (PYE) High Bandwidth Memory (HBM) Electrical Failure Analysis (EFA) Engineer for Micron Technology, Inc., you will work with a team responsible for taking next generation HBM devices from design to mass production!

We focus on failure analysis of test, internal qualification, and RMA failures, allowing for enhanced product reliability, rapid production ramp and early time to market. Our primary areas of responsibility apply fault isolation with a combination of electrical and physical characterization techniques combined with data analysis to identify physical defects introduced by process level or assembly step. Y...

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Job Overview

Job Type: Full-time
Location: Boise, United States
Posted: June 06, 2026
Deadline: June 11, 2026