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R&D Application Engineer
MacDermid Alpha Electronics Solutions
Full-time
Singapore, Singapore
Chemical Manufacturing,Appliances, Electrical, and Electronics Manufacturing
Posted:
February 20, 2026
Location:
Singapore, Singapore, Singapore
Job Description
Business Unit: MAES
Division: Semiconductor Assembly R&D
Challenge Yourself and Impact the Future!
MacDermid Alpha Electronics Solutions, a business of Element Solutions Inc (NYSE: ESI), is renowned worldwide for its commitment to revolutionizing the electronics industry. With a legacy spanning over a century, we have continually set new benchmarks for excellence, reliability and sustainability in electronic materials.
Our Expertise:
Wafer Level Solutions - Revolutionizing wafer fabrication processes for enhanced efficiency and performance
Semiconductor Assembly Solutions - Driving innovation in semiconductor assembly processes for unparallelled reliability
Circuitry Solutions - Tailored solutions to meet the dynamic demands of modern circuitry
Circuit Board Assembly Solutions - Elevating circuit board assembly processes for optimal performance
Film & Smart Surfac...
Division: Semiconductor Assembly R&D
Challenge Yourself and Impact the Future!
MacDermid Alpha Electronics Solutions, a business of Element Solutions Inc (NYSE: ESI), is renowned worldwide for its commitment to revolutionizing the electronics industry. With a legacy spanning over a century, we have continually set new benchmarks for excellence, reliability and sustainability in electronic materials.
Our Expertise:
Wafer Level Solutions - Revolutionizing wafer fabrication processes for enhanced efficiency and performance
Semiconductor Assembly Solutions - Driving innovation in semiconductor assembly processes for unparallelled reliability
Circuitry Solutions - Tailored solutions to meet the dynamic demands of modern circuitry
Circuit Board Assembly Solutions - Elevating circuit board assembly processes for optimal performance
Film & Smart Surfac...
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Job Type:
Full-time
Location:
Singapore, Singapore
Posted:
February 20, 2026
Deadline:
April 01, 2026