R&D Process Engineer / Senior Engineer (Mold)

Job Title: R&D Process Engineer (MOLD)

Process development and characterization for R&D projects. To lead the development, optimization, and stabilization of wafer level molding and related processes for advanced semiconductor packaging, contributing to mass production readiness, yield improvement, and customer‑specific technical solutions.

Responsibilities

• Develop wafer level molding and debond process capabilities to achieve a good quality and wafer warpage for advanced packaging technologies including 2.5D, fan‑out, and SiP.
• Perform DOE planning, continuous improvement, engineering evaluation and analyze experimental data using statistical tools (e.g., JMP).
• Qualify new materials (direct and indirect), tools, equipment on new package and device qualification.
• Conduct pre‑production process validation and yield stabilization.
• Provide technical support for customer programs.
• Troub...