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Posted:
June 17, 2026
Location:
Redmond, WA, United States
Job Description
Semiconductor Packaging Engineer
Sigma Design is a product development, engineering, and manufacturing firm. Based out of the Pacific Northwest, we offer innovative concept through production services to diverse clients around the globe. Sigma Design believes in hiring, developing, and recognizing the best. We offer competitive compensation, a 401(k) with up to 4% company match, quarterly bonus program, 15-days of accrued PTO and 9 company paid holidays. In addition, Sigma Design has multiple options for medical insurance and dental insurance. We also offer voluntary benefits: vision, long-term disability, and life insurance.
Position Details:
+ This position will be In-Office
+ $115,000 - $140,000 annually
+ This is a contract position with an expected duration of 12 months and the opportunity to be extended.
Primary Function:
The Semiconductor Packaging Engineer is responsible for developing, executing, and...
Sigma Design is a product development, engineering, and manufacturing firm. Based out of the Pacific Northwest, we offer innovative concept through production services to diverse clients around the globe. Sigma Design believes in hiring, developing, and recognizing the best. We offer competitive compensation, a 401(k) with up to 4% company match, quarterly bonus program, 15-days of accrued PTO and 9 company paid holidays. In addition, Sigma Design has multiple options for medical insurance and dental insurance. We also offer voluntary benefits: vision, long-term disability, and life insurance.
Position Details:
+ This position will be In-Office
+ $115,000 - $140,000 annually
+ This is a contract position with an expected duration of 12 months and the opportunity to be extended.
Primary Function:
The Semiconductor Packaging Engineer is responsible for developing, executing, and...
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Submit your application for the Semiconductor Packaging Engineer position at Sigma Design.
Apply Now Save for LaterJob Overview
Job Type:
Full-time
Location:
Redmond, United States
Posted:
June 17, 2026
Deadline:
June 22, 2026