Senior ASIC Design Engineer, Low Power Audio AI Subsystems

Company Qualcomm Canada ULC

Job Area Engineering Group > ASICS Engineering

General Summary Shape the future of low power AI subsystems. Push the boundaries on features and performance. Qualcomm Technologies Audio products are designed to offer premium wireless connectivity, high levels of integration, immersive sound quality, and on-device AI for smart audio and context aware applications. An ultra-low power subsystem within a low power SoC; a chip-within-a-chip HW block incorporating multiple always-on IP's. Design execution within this group requires solving groundbreaking challenges and multiple power domain crossing issues. As we deliver to the premium tiers of the mobile, compute, automotive, and IoT markets, we strive to pioneer new and/or improved functionality and innovate to minimize power consumption. Make a difference, join a team on the cutting edge and become an integral part of Qualcomm’s growth and momentum.

Replacement position.

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