A*
Senior Electrochemical Plating Process Engineer (APM), IME
A*STAR
Full-Time
Singapore, Singapore
Engineers
Posted:
March 02, 2026
Location:
Singapore, Singapore, Singapore
Job Description
About the Role:
We are seeking a highly experienced and driven Senior Electrochemical Plating Process Engineer to join our advanced packaging and semiconductor process development team. The ideal candidate will bring deep expertise in BEOL ECP processes, including Cu RDL, Cu pillar, TSV, and UBM plating, as well as strong capabilities in process control, equipment qualification, and yield improvement.
Key Responsibilities:
Lead development and optimization of ECP processes for advanced packaging applications (e.g., Cu/Ni/Au plating, SnAg bump/solder plating).
Drive process control and SPC for BEOL PVD and ECP processes, including Ti/Cu seed layers and barrier films.
Manage equipment procurement, qualification, and supplier sourcing for plating chemicals and consumables.
Support integration and yield improvement for SVP builds such as WLP, FOWLP, and C2W.
Conduct D...
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Job Type:
Full-Time
Location:
Singapore, Singapore
Posted:
March 02, 2026
Deadline:
April 11, 2026