Senior Electrochemical Plating Process Engineer (APM), IME

Senior Electrochemical Plating Process Engineer (APM), IME

Posting Date : 26 Jan 2026 | Closing Date :27 Mar 2026

About the Role:

We are seeking a highly experienced and driven Senior Electrochemical Plating Process Engineer to join our advanced packaging and semiconductor process development team. The ideal candidate will bring deep expertise in BEOL ECP processes, including Cu RDL, Cu pillar, TSV, and UBM plating, as well as strong capabilities in process control, equipment qualification, and yield improvement.

Key Responsibilities:

• Lead development and optimization of ECP processes for advanced packaging applications (e.g., Cu/Ni/Au plating, SnAg bump/solder plating).
• Drive process control and SPC for BEOL PVD and ECP processes, including Ti/Cu seed layers and barrier films.
• Manage equipment procurement, qualification, and supplier sourcing for plating chemicals and consumables.
• Support int...