Posted:
March 03, 2026
Location:
Shanghai, Shanghai, China

Job Description

Job Description

  • SIP assembly process and packaging engineer, BGA/LGA products packaging.
  • Develop and optimize new process recipes to achieve high capability for future products.
  • Evaluate and introduce advanced packaging process technology.
  • Collaborate with material/equipment team to develop new material/equipment technology.
  • Work with the global team on new product design, evaluation, and introduction.
  • Partner with the Pathfinding team to achieve leading PKG technology targets.

Qualifications

  • Master or above, major in Automation, Mechatronics, Materials Science and Technology, etc. 
  • Good communication skill and team work spirit, willing to work under certain pressure.

REQUIRED:

  • Master or above, major in Automation, Mechatronics, Materials Science and Technology, etc. 
  • Good communication skill and team work spirit, willing to work under certain pre...

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Submit your application for the Senior Engineer, Packaging Development Engineering(Only to New College Graduates) position at Sandisk.

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Job Overview

Job Type: full-time
Location: Shanghai, China
Posted: March 03, 2026
Deadline: April 12, 2026