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Senior Engineer, Packaging Engineering (Thermal Design)
Sandisk
full-time
Batu Kawan, Penang
Engineers
Posted:
June 05, 2026
Location:
Batu Kawan, Penang, Malaysia
Job Description
Job Description
Qualifications
ESSENTIAL DUTIES AND RESPONSIBILITIES:
- As a Packaging Engineer, you will work in the Packaging R&D group on thermal designs across semiconductor packaging level, flash product printed circuited board assembly (PCBA) level, and host level.
- The ideal candidate will be responsible for thermal modeling (CFD) and validation of flash products PCBA using analytical/numerical analysis and measurement techniques.
- The focus will be on solutions to meet increased demands for small form factor packages with constrained physical and thermal environments.
Qualifications
REQUIRED:
- B.S. in Mechanical Engineering plus 5 years, of relevant industry experience
- Solid knowledge through academic coursework or experience required in Mechanical design
- Proficiency in CAD software (e.g. SolidWorks, Autocad)
- Knowledge of engineering drafting stand...
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Job Type:
full-time
Location:
Batu Kawan, Malaysia
Posted:
June 05, 2026
Deadline:
July 15, 2026