Senior Engineer, Packaging Engineering (Thermal Design)

Sandisk
full-time Batu Kawan, Penang Engineers
Posted:
June 05, 2026
Location:
Batu Kawan, Penang, Malaysia

Job Description

Job Description

ESSENTIAL DUTIES AND RESPONSIBILITIES:

  • As a Packaging Engineer, you will work in the Packaging R&D group on thermal designs across semiconductor packaging level, flash product printed circuited board assembly (PCBA) level, and host level.
  • The ideal candidate will be responsible for thermal modeling (CFD) and validation of flash products PCBA using analytical/numerical analysis and measurement techniques.
  • The focus will be on solutions to meet increased demands for small form factor packages with constrained physical and thermal environments.

Qualifications

REQUIRED:

  • B.S. in Mechanical Engineering plus 5 years, of relevant industry experience
  • Solid knowledge through academic coursework or experience required in Mechanical design
  • Proficiency in CAD software (e.g. SolidWorks, Autocad)
  • Knowledge of engineering drafting stand...

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Job Overview

Job Type: full-time
Location: Batu Kawan, Malaysia
Posted: June 05, 2026
Deadline: July 15, 2026