Ac
Posted:
February 23, 2026
Location:
Kuala Lumpur, Kuala Lumpur, Malaysia
Job Description
EEO
WO#3 Cards
Job Title: Senior L3 Support - Appl. Dev Mgt
Domain: Cards
Sub-Domain: Application Development Management
Experience Level: L3 (6-9 years)
Location: Kuala Lumpur
Job Summary: We are seeking a Senior L3 Support Engineer with 6-9 years of experience to provide application maintenance and production support for card systems within the Core Banking domain. The role requires strong expertise in Mainframe technologies (Cobol, CICS, JCL) with hands-on experience in compliance-related applications. The candidate will be responsible for supporting mission-critical card applications, managing incidents, and ensuring smooth operations across VSAM and sequential datasets. Experience in SDLC and banking projects, preferably in Cards, is essential.
Key Responsibilities:
Provide L3 support for card-related applications, ensuring compliance and operational stability.
Troubleshoot and resolve complex issues in Mainframe Cobol, CICS, and JCL programs.
Perf...
WO#3 Cards
Job Title: Senior L3 Support - Appl. Dev Mgt
Domain: Cards
Sub-Domain: Application Development Management
Experience Level: L3 (6-9 years)
Location: Kuala Lumpur
Job Summary: We are seeking a Senior L3 Support Engineer with 6-9 years of experience to provide application maintenance and production support for card systems within the Core Banking domain. The role requires strong expertise in Mainframe technologies (Cobol, CICS, JCL) with hands-on experience in compliance-related applications. The candidate will be responsible for supporting mission-critical card applications, managing incidents, and ensuring smooth operations across VSAM and sequential datasets. Experience in SDLC and banking projects, preferably in Cards, is essential.
Key Responsibilities:
Provide L3 support for card-related applications, ensuring compliance and operational stability.
Troubleshoot and resolve complex issues in Mainframe Cobol, CICS, and JCL programs.
Perf...
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Job Type:
Full-time
Location:
Kuala Lumpur, Malaysia
Posted:
February 23, 2026
Deadline:
April 04, 2026