Senior Microelectronic Packaging Design Engineer

Sanmina
Full-time ottawa, on Other-General
Posted:
June 17, 2026
Location:
ottawa, on, Canada

Job Description

A leading technology firm in Ottawa is seeking a Microelectronic Packaging Design Engineer to support technology and product development programs. You will work with a team to design microelectronic packages and modules, ensuring compliance with product requirements. The ideal candidate has a Bachelor's Degree in Mechanical Engineering or similar, along with over 8 years of experience in hardware design, packaging, and tool proficiency. This role is significant for innovative projects in various emerging markets.
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Job Overview

Job Type: Full-time
Location: ottawa, Canada
Posted: June 17, 2026
Deadline: July 27, 2026