Te
Posted:
March 03, 2026
Location:
Melaka, Malaysia, Malaysia
Job Description
**Change the world. Love your job.**
As a Packaging engineer you will enjoy an environment of smart collaboration with a global team of the industry’s top engineering minds at your disposal. TI’s corporate culture is one of competitive spirit which fuels continued business growth and constant career opportunities. While ethical business practice is a central aspect of the work place-you will be treated with respect, dignity, kindness and courtesy.
**2 available positions:**
1. **Power Module**
1. Optimizing and establishing robust and high-speed process parameters for various component attach processes, stack-up, and molding (transfer or compression) technology
2. Defining simplified manufacturing process sequence for different components attach
3. Broad and deep technical understanding of PCB / Substrate / Laminate / MIS manufacturing.
2. **Leaded Module**
1. Optimizing and establishing robus...
As a Packaging engineer you will enjoy an environment of smart collaboration with a global team of the industry’s top engineering minds at your disposal. TI’s corporate culture is one of competitive spirit which fuels continued business growth and constant career opportunities. While ethical business practice is a central aspect of the work place-you will be treated with respect, dignity, kindness and courtesy.
**2 available positions:**
1. **Power Module**
1. Optimizing and establishing robust and high-speed process parameters for various component attach processes, stack-up, and molding (transfer or compression) technology
2. Defining simplified manufacturing process sequence for different components attach
3. Broad and deep technical understanding of PCB / Substrate / Laminate / MIS manufacturing.
2. **Leaded Module**
1. Optimizing and establishing robus...
Apply for this Job
Submit your application for the Senior Packaging Engineer (Power Module) position at Texas Instruments.
Apply Now Save for LaterJob Overview
Job Type:
Full-time
Location:
Melaka, Malaysia
Posted:
March 03, 2026
Deadline:
April 05, 2026