Senior Packaging Engineer — SiP/IC Assembly Leader

Sandisk in Batu Kawan, Malaysia is looking for an experienced professional to lead SiP assembly and IC packaging processes. The ideal candidate will have a strong background in engineering with at least 8 years of relevant experience in the semiconductor industry.

Responsibilities include developing process documentation, leading qualification programs, and collaborating with cross-functional teams to drive continuous improvement. Strong analytical and troubleshooting skills are essential, along with proficiency in statistical data analysis tools.