Senior Packaging Engineer: Thermal Design for Semiconductors

Sandisk is seeking a Packaging Engineer to join our R&D group in Batu Kawan, Malaysia. The role focuses on thermal designs for semiconductor packaging and ensuring that products meet packaging demands.

Ideal candidates will have a B.S. in Mechanical Engineering and 5 years of relevant experience. Proficiency in CAD software and a strong work ethic are crucial. Join us to innovate packaging solutions and improve product designs.