Senior Packaging Engineering Manager - Bump, DPS & Assembly

A leading semiconductor company is seeking a Packaging Technology Development Manager in Singapore. The role involves engaging with OSAT partners, managing multiple package development projects, and leading the introduction of new technologies. The ideal candidate will have over 10 years of experience in semiconductor packaging, strong leadership, and communication skills. This position requires a proactive attitude and the ability to work effectively in a fast-paced environment.
#J-18808-Ljbffr