Senior Process Engineer: Die Attach & Wire Bond Innovation

A leading semiconductor company in Penang is seeking an engineer to develop and optimize Die Attach and Wire Bond processes. Candidates should hold a Degree or Master in Engineering with 2-3 years of experience in the semiconductor field. Responsibilities include supporting technology roadmap activities and providing coaching to junior staff. This role focuses on meeting project targets for quality and cost while participating in engineering sample and ramp-up builds.
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