Posted:
March 04, 2026
Location:
Kampung Krubong, Malacca, Malaysia

Job Description

A leading semiconductor company in Malaysia is seeking a Senior Package Development Engineer to design and implement new sensor products and packages. The ideal candidate should have a Bachelor's degree in Engineering and a minimum of 2 years of relevant experience in semiconductor packaging. Strong analytical and problem-solving skills are essential, along with knowledge of CAD tools. Join us to enjoy a comprehensive benefits package and a collaborative work environment.
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Job Overview

Job Type: Full-time
Location: Kampung Krubong, Malaysia
Posted: March 04, 2026
Deadline: April 13, 2026