Senior Staff R&D Design Technology Integration Engineer (WLP, Bump, Die Sort)

Qualcomm
Full-time Singapore, Singapore Semiconductor Manufacturing
Posted:
February 28, 2026
Location:
Singapore, Singapore, Singapore

Job Description

Company
Qualcomm Asia Pacific Pte. Ltd.
Job Area
Engineering Group, Engineering Group > Hardware Engineering
General Summary
Description:
Join this team focused on RF Front End Modules for the Cellular and Wireless Data markets. You will be part of the Business Unit Engineering organization and work directly with and support multiple product development teams.
Position requires a senior technical specialist who can provide leadership in the development of new and sustainable technology platforms for the company using a solid background in materials, device physics, front end or back end processes, and supplier interactions.
Responsibilities
  • Exhibit skill and confidence in working cross-functionally across a matrix organization in a very dynamic and fast-paced environment.
  • Support development of advanced technologies for Si / GaAs backend interconnect, passiv...

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Job Overview

Job Type: Full-time
Location: Singapore, Singapore
Posted: February 28, 2026
Deadline: April 09, 2026