Senior Substrate & Lead Frame Design Engineer

Infineon Technologies AG in Malaysia is seeking an experienced technical expert in substrates, lead frames, and packing materials for critical development projects. You will collaborate with internal teams and suppliers, driving activities to meet quality and manufacturing requirements.

The ideal candidate holds a Bachelor's Degree in Engineering with at least 7 years of experience in semiconductor assembly and packaging, proficient in AutoCAD and Cadence design tools. The role supports innovation and fosters an inclusive work environment.