Senior TCB Application & Technical Sales Engineer

Responsibilities: Engage semiconductor customers to understand packaging roadmap, process requirements, throughput targets, yield and reliability challenges. Support technical sales activities and customer discussions. Benchmark competitor equipment and identify technology gaps. Translate customer requirements into internal equipment specifications. Develop and optimize TCB process parameters on TCB Equipments. Support advanced packaging applications including HBM, CoWoS, CoPoS, 2.5D Packaging, 3D Packaging and Chiplet Integration. Troubleshoot bonding issues such as non-wet, misalignment, voids, delamination and warpage. Conduct DOE and process characterization activities. Work closely with Mechanical, Software, Electrical, Motion and Vision teams. Define alignment accuracy, thermal performance, bond force profiles, throughput targets and process windows. Lead machine qualification, FAT and SAT activities. Act as the internal customer during machine development. Support customer buyof...