Job Description
Senior Wire Bond Equipment & Process Engineer
Location:
Tuanku Jaafar Industrial Park, Seremban, Negeri Sembilan
Industry:
Semiconductor Manufacturing (Global Integrated Device Manufacturer)
Salary:
RM6,000
Qualification:
Degree in Engineering (Electrical / Electronic / Mechatronic / Related)
Experience:
Minimum 5 years relevant experience
About the Company
A global semiconductor manufacturer with advanced assembly and test operations in Negeri Sembilan is seeking a Senior Engineer to support high-volume production and continuous process innovation. The organization operates within a fast-paced, technology-driven environment serving automotive and industrial markets.
What You Will Do
• Lead setup, qualification, optimization (CZ/DOE) of
wire bonding equipment and processes
• Drive process improvements to enhance
yield, reliability, and throughput
• Troubleshoot and resolve e...
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Submit your application for the Senior Wire Bond Equipment position at Confidential.
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