Senior Wire Bond Equipment

Senior Wire Bond Equipment & Process Engineer
Location: Tuanku Jaafar Industrial Park, Seremban, Negeri Sembilan
Industry: Semiconductor Manufacturing (Global Integrated Device Manufacturer)
Salary: RM6,000
Qualification: Degree in Engineering (Electrical / Electronic / Mechatronic / Related)
Experience: Minimum 5 years relevant experience
About the Company
A global semiconductor manufacturer with advanced assembly and test operations in Negeri Sembilan is seeking a Senior Engineer to support high-volume production and continuous process innovation. The organization operates within a fast-paced, technology-driven environment serving automotive and industrial markets.
What You Will Do
• Lead setup, qualification, optimization (CZ/DOE) of wire bonding equipment and processes
• Drive process improvements to enhance yield, reliability, and throughput
• Troubleshoot and resolve equipment and process issues in a high-volume production environment
• Support...