Senior/Staff Wire Bond Equipment & Process Engineer

Nexperia

Full-time Seremban, Negeri Sembilan Engineers

Posted:

March 03, 2026

Location:

Seremban, Negeri Sembilan, Malaysia

Job Description

About the Role 
We are seeking a Senior Wire Bond Equipment & Process Engineer to join our dynamic team. In this role, you will leverage your expertise in wire bonding technology to optimize semiconductor manufacturing processes and ensure the highest quality and reliability in production. You will work closely with cross-functional teams, including R&D, process engineering, and manufacturing, to drive continuous improvement and innovation.
What You Will Do
Lead the setup, qualification, and optimization/CZ/DOE of wire bonding equipment and processes.
Develop and implement process improvements to enhance yield, reliability, and throughput.
Troubleshoot, Disposition and resolve equipment and process issues in a fast-paced production environment.
Collaborate with design, quality, and manufacturing teams to support new product introductions.
Analyze process data to identify trends and implement corrective or preventative ...
                

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Job Overview

Job Type: Full-time

Location: Seremban, Malaysia

Posted: March 03, 2026

Deadline: April 12, 2026