Posted:
June 06, 2026
Location:
Munich, Bavaria, Germany

Job Description

About the role

As Senior Principal Engineer – GaN Package Development (m/f/d), you will be a technical authority and innovation leader responsible for defining, developing, and industrializing advanced packaging technologies for GaN power devices and modules.

This role drives package architecture strategy, leads complex cross‑functional programs from concept to high‑volume manufacturing, and serves as a key technical interface across R&D, manufacturing, suppliers, and customers.

The position requires deep expertise in GaN backend technologies, strong system‑level understanding of power device requirements, and proven leadership in introducing new packaging platforms into production.

This is your new job

  • Lead GaN package architecture development, from concept through validation, optimizing electrical, thermal, and reliability performance

  • Drive innovation in packaging technologies, materials, and process solutions tailored...

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    Job Overview

    Job Type: Full-time
    Location: Munich, Germany
    Posted: June 06, 2026
    Deadline: July 16, 2026