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Sr. Technical Program Manager, Amazon Pay | Credit & Lending
ADCI - Karnataka
full-time
Bengaluru, Karnataka
Operations Specialties Managers
Posted:
June 04, 2026
Location:
Bengaluru, Karnataka, India
Job Description
Are you excited about building the future of digital lending at massive scale? Do you want to shape a greenfield lending platform that combines technology, compliance, risk, payments, accounting, and customer experience across emerging international markets?
The Credit & Lending team at Amazon Pay is building Amazon’s next-generation lending platform to enable seamless credit experiences for millions of customers across Latin America. This is a high-visibility, high-ownership role at the intersection of fintech innovation, large-scale distributed systems, regulatory compliance, and customer obsession.
As a Senior TPM, you will lead complex cross-functional programs spanning engineering, product, finance, tax, compliance, risk, legal, operations, and external financial partners. You will help define and drive the roadmap for Amazon’s in-house lending capabilities across LATAM markets, enabling scalable and reusable technology foundations for onboarding, underwriting, servicing, ...
The Credit & Lending team at Amazon Pay is building Amazon’s next-generation lending platform to enable seamless credit experiences for millions of customers across Latin America. This is a high-visibility, high-ownership role at the intersection of fintech innovation, large-scale distributed systems, regulatory compliance, and customer obsession.
As a Senior TPM, you will lead complex cross-functional programs spanning engineering, product, finance, tax, compliance, risk, legal, operations, and external financial partners. You will help define and drive the roadmap for Amazon’s in-house lending capabilities across LATAM markets, enabling scalable and reusable technology foundations for onboarding, underwriting, servicing, ...
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Apply Now Save for LaterJob Overview
Job Type:
full-time
Location:
Bengaluru, India
Posted:
June 04, 2026
Deadline:
July 14, 2026