Sr Wire Bond NPI Engineer

Job Summary:

onsemi is currently seeking an experienced Process Engineer to work on product qualification (NPI/NPD, fab transfer, In-sourcing, others as deemed necessary) and safe launch lots for ultrasonic wirebond and IVI processes for all the product groups. Lead investigation on issues / EFAR cases related to ultrasonic wire bonding process under NPI category and lead WB technology and material roadmap.

Competencies

• Leading WB Set-up fo New Product Introductions
• Knowledge on Orthodyne and KNS/Power fusion wirebond platforms with deep understanding on the parameters, materials and tools. 
• Establishing process windows using DOE and pareto analysis
• Ability to improve Cpk/Cp and DPMO for WB parameters
• Root‑cause analysis of bond lifts, non‑sticks, wire breaks, cratering
• Correlation of WB defects to substrate, leadframe, die, and mold compound interactions. 
• Driving safe‑launch strategies a...