Home / Jobs / Staff Package Design Engineer- experienced in package development of power SiP/module
Posted:
June 04, 2026
Location:
Hsinchu County, Hsinchu County, Taiwan

Job Description

Job Description

  • Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, wafer level,  flip-chip, multi-chip module and power device packaging.
  • Package technologies qualification for consumer & industrial power as well as automotive power applications.
  • Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM).
  • Work with OSAT/CM  to develop, run DOE to optimize processes and establish process spec.
  • Work with Product groups and Reliability team, qualify new packages and processes within required time frame.
  • Resolve all process integration issues by ensuring all window checks are done on critical process steps.
  • Establish production controls and monitor to ensure there is no room for quality incidents.
  • Ensure smooth transition into production & implement ramp up monitor. &#x...

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Job Overview

Job Type: full-time
Location: Hsinchu County, Taiwan
Posted: June 04, 2026
Deadline: July 14, 2026