Staff Package Development Engineer

Job Description





+ Responsible for improving/developing existing assembly processes & materials working with OSATs across Asia to achieve target yield & quality and zero out customer returns/complaints. Primarily Wirebond, Die Bond & Mold processes.



+ Responsible for Developing new assembly technologies such as:





+ Hybrid Wire Bonding (Al Heavy & Fine Wire Ultrasonic Bonding combined with Cu/PCC & Au Heavy Wire Bonding), Ribbon Bonding.



+ Stacked Dice & Bridged Die Bonding on Leadframe Pad and DBC, Clip Bonding



+ High CTI, high Thermal, Low Stress Vacuum assisted Molding Technologies





+ Responsible for defining package design rules, process flow and material set for new products including automotive power module packages



+ Drive alignment between GaN Power Discrete design requirements and supplier capabilities, to enab...