Staff Packaging SI Engineer

Broadcom
Full-time Yishun, Singapore other-general
Posted:
February 26, 2026
Location:
Yishun, Singapore, Singapore

Job Description

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**Job Description:**









• Perform electromagnetic extractions on interconnects in IC Packages and PCBs, using tools such as Ansys HFSS, Q3D, SIWave, etc.,

• Perform signal integrity circuit simulations on parallel digital interfaces such as DDR, analog SerDes channels and Power Delivery Networks (PDN), using tools such as ADS, Ansys Designer or HSpice.

• Work closely with IC Package Design engineers for electrical design optimization of Packaging Interconnects and PDN

• Work closely with IP owners, chip leads, package and PCB design engineers to optimize Bump/Ball ma...

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Job Overview

Job Type: Full-time
Location: Yishun, Singapore
Posted: February 26, 2026
Deadline: March 31, 2026