TE
Posted:
June 13, 2026
Location:
SURVEY NOS.11/1, India, India
Job Description
SUPV QLTY & RELIABILITY ENGINEERING
Posting Start Date: 6/10/26
At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world.
Job Description:
**Job Overview**
Lead the lab in supporting various global TE locations for Connector validation. Regular interactions to understand validation requirements from internal and external customers (Product Engineers, OEM’s) as per international standards, TE Product specification and Customer specific standards, and effectively translating them into validation methods.
**KEY RESPONSBILITIES**
8 to 10 years of experience in the areas of Automotive LV/HV Connector and Data connectivity connector testing or other similar industry
• Manage lab schedule including capacity and resource allocation.
• Own lab performance metrics including Safety, On Time Delivery, and Quality
• ...
Posting Start Date: 6/10/26
At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world.
Job Description:
**Job Overview**
Lead the lab in supporting various global TE locations for Connector validation. Regular interactions to understand validation requirements from internal and external customers (Product Engineers, OEM’s) as per international standards, TE Product specification and Customer specific standards, and effectively translating them into validation methods.
**KEY RESPONSBILITIES**
8 to 10 years of experience in the areas of Automotive LV/HV Connector and Data connectivity connector testing or other similar industry
• Manage lab schedule including capacity and resource allocation.
• Own lab performance metrics including Safety, On Time Delivery, and Quality
• ...
Apply for this Job
Submit your application for the SUPV QLTY & RELIABILITY ENGINEERING position at TE Connectivity.
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Job Type:
Full-time
Location:
SURVEY NOS.11/1, India
Posted:
June 13, 2026
Deadline:
June 18, 2026