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Windows Power/Thermal System Software Engineer_Hsinchu/Taipei
MediaTek
Full-time
Taiwan, Taipei City
Computer Occupations
Posted:
February 19, 2026
Location:
Taiwan, Taipei City, Taiwan
Job Description
Job Description•Develop power and thermal management software and firmware for Windows on ARM system
• Benchmark and profile power and thermal information for Windows on ARM platforms
• Analyze power and thermal related issues for Windows on ARM system
#LI-LYNNRequirement• Master or above with major in CS or EE related fields
• 3+ years experience in embedded system development
• Experience in UEFI / ACPI / SMBIOS / EC development
• Experience in power management on Linux or Windows such as CPU DVFS, CPU idle, system suspend
Preferred qualifications:
• Experience in thermal management such as passive and active thermal throttling on Linux or Windows
• Familiar with power and thermal measurement and profiling tools
• Familiar with Windows system boot flow and debugging
• Familiar with Windows on ARM system architecture and driver development
• Familiar with WHCP / WHLK certification
• Experience in cross-team collaboration and com...
• Benchmark and profile power and thermal information for Windows on ARM platforms
• Analyze power and thermal related issues for Windows on ARM system
#LI-LYNNRequirement• Master or above with major in CS or EE related fields
• 3+ years experience in embedded system development
• Experience in UEFI / ACPI / SMBIOS / EC development
• Experience in power management on Linux or Windows such as CPU DVFS, CPU idle, system suspend
Preferred qualifications:
• Experience in thermal management such as passive and active thermal throttling on Linux or Windows
• Familiar with power and thermal measurement and profiling tools
• Familiar with Windows system boot flow and debugging
• Familiar with Windows on ARM system architecture and driver development
• Familiar with WHCP / WHLK certification
• Experience in cross-team collaboration and com...
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Job Type:
Full-time
Location:
Taiwan, Taiwan
Posted:
February 19, 2026
Deadline:
March 31, 2026